Bourns provides a recommended layout guide in their application note AN-216, which includes guidelines for PCB layout, component placement, and thermal management.
Bourns recommends following the derating curves provided in the datasheet, and ensuring that the device is operated within the specified temperature range. Additionally, proper thermal management, such as using a heat sink, can help to reduce the device's operating temperature.
Bourns recommends following the JEDEC J-STD-020C soldering profile, which includes a peak temperature of 260°C (500°F) for a maximum of 10 seconds.
The ISOM3-320-R-L2 is designed to meet the requirements of IEC 60068-2-6, which includes a sinusoidal vibration of 10-2000 Hz, 1.5 mm displacement, and 10 G acceleration. It's recommended to consult with Bourns' application engineers for specific vibration requirements.
Bourns recommends storing the devices in their original packaging, in a dry, with a temperature range of -40°C to 125°F (-40°C to 257°F). Handling should be done with anti-static precautions, such as using an ESD wrist strap or mat.
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