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ISP752TFUMA1 - Infineon

Description: INFINEON - ISP752TFUMA1 - POWER SWITCH, HIGH-SIDE, 52V, SOIC-8

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ISP752TFUMA1 Details

  • Manufacturer Part Number:

    ISP752TFUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    PLASTIC, GREEN, DSO-8

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7.05

  • Built-in Protections:

    OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Output Current Flow Direction:

    SOURCE

  • Output Peak Current Limit-Nom:

    6.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    52 V

  • Supply Voltage-Min:

    6 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    200 µs

  • Turn-on Time:

    180 µs

  • Width:

    4 mm

ISP752TFUMA1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure efficient heat dissipation.
  • Use a shielded enclosure, keep the device away from antennas and high-frequency sources, and ensure proper grounding and decoupling of the device and surrounding components.
  • The device can operate from -40°C to 150°C, but the recommended operating temperature range is -20°C to 125°C for optimal performance and reliability.
  • The device requires a specific power-up sequence to ensure proper operation. The recommended sequence is: VCC, then VBAT, then VREG. Ensure that VCC is stable before applying VBAT and VREG.
  • Use a reflow soldering process with a peak temperature of 260°C and a dwell time of 30-60 seconds. Avoid wave soldering and hand soldering, as they can cause damage to the device.

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ISP752TFUMA1 Overview

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