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ISP75N - Infineon

Description: Power Switch/Driver 1:1 N-Channel 700mA PG-SOT223-4

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PCB Footprints
ISP75N - Infineon PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - PG-SOT223-4
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ISP75N - Infineon  - 3D model - SOT223 (3-Pin) - PG-SOT223-4
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ISP75N Details

  • Manufacturer Part Number:

    ISP75N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-223

  • Package Description:

    GREEN, PLASTIC, SOT-223, 4 PIN

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    0.7 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOT-223

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.8 mm

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.3 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    20 µs

  • Turn-on Time:

    20 µs

  • Width:

    3.5 mm

ISP75N Frequently Asked Questions (FAQs)

  • Infineon recommends a PCB layout with a large copper area connected to the drain pin (pin 3) to dissipate heat efficiently. A minimum of 2 oz copper thickness and a thermal via array under the device are recommended.
  • To ensure proper biasing, connect a 10 kΩ resistor between the gate pin (pin 1) and the source pin (pin 2). This sets the gate-source voltage to around 2.5 V, which is the recommended operating point.
  • The maximum allowed power dissipation for ISP75N is 2.5 W. Exceeding this limit can lead to device failure. Ensure that the device is properly cooled and the power dissipation is within the specified limit.
  • Yes, ISP75N is suitable for high-frequency switching applications up to 100 kHz. However, ensure that the device is properly biased and the PCB layout is optimized for high-frequency operation.
  • To protect ISP75N from ESD, handle the device by the body or use an anti-static wrist strap. Ensure that the PCB and components are properly grounded, and use ESD protection devices such as TVS diodes or ESD protection arrays.

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ISP75N Overview

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