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ISP772T - Infineon

Description: Power Switch ICs - Power Distribution SMART HI SIDE SWITCH INDUSTRIAL APP 2.6A

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ISP772T - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO8
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ISP772T - Infineon  - 3D model - Small Outline Packages - PG-DSO8
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ISP772T Details

  • Manufacturer Part Number:

    ISP772T

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    1.8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    34 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    13.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    230 µs

  • Turn-on Time:

    180 µs

  • Width:

    4 mm

ISP772T Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a common mode filter and a shielded cable for the USB interface.
  • Use a metal shield around the ISP772T and the surrounding components. Ensure a good ground connection between the shield and the PCB ground. Use a common mode filter and a shielded cable for the USB interface. Follow the layout guidelines in the datasheet.
  • The ISP772T supports cable lengths up to 3 meters (10 feet) for USB 2.0 and up to 1 meter (3.3 feet) for USB 3.0. However, the actual cable length may vary depending on the specific application and cable quality.
  • The ISP772T has an integrated voltage regulator. Connect a 3.3V power supply to the VCC pin. Ensure a decoupling capacitor (e.g., 10uF) is placed close to the VCC pin. Use a power-on reset circuit to ensure a clean power-up sequence.
  • The ISP772T has a thermal pad on the bottom side. Ensure good thermal conductivity by using a thermal interface material (e.g., thermal tape or thermal grease) between the thermal pad and a heat sink or a metal plate. Keep the ambient temperature below 85°C (185°F).

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ISP772T Overview

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