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ITP0324S3V3 - XP POWER

Description: XP Power ITP 3W Isolated DC-DC Converter Through Hole, Vin 9 → 36 V dc, Vout 3.3V dc, I/O isolation 1600V dc

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PCB Footprints
ITP0324S3V3 - XP POWER PCB footprint - Other - Other - ITP0324S3V3-2
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3D Models
ITP0324S3V3 - XP POWER  - 3D model - Other - ITP0324S3V3-2
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ITP0324S3V3 Details

  • Manufacturer Part Number:

    ITP0324S3V3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PACKAGE-6/5

  • ECCN Code:

    EAR99

  • Manufacturer:

    XP Power

  • YTEOL:

    6

  • Analog IC - Other Type:

    DC-DC REGULATED POWER SUPPLY MODULE

  • Approvals:

    CE, EN, UL, UKCA

  • Efficiency (Main Output):

    76%

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    9 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-PSIP-T5

  • Length:

    17 mm

  • Line Regulation-Max:

    0.2%

  • Load Regulation-Max:

    1%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    75 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.7 A

  • Output Voltage-Max:

    3.333 V

  • Output Voltage-Min:

    3.267 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SIP

  • Package Equivalence Code:

    SIP5/6,.10

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Protections:

    OVER CURRENT; SHORT CIRCUIT

  • Ripple Voltage (Main Out):

    0.053025 Vrms

  • Screening Level:

    UL 62328-1

  • Seated Height-Max:

    12.2 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Total Power Output-Max:

    3 W

  • Trim/Adjustable Output:

    NO

  • Width:

    10.2 mm

ITP0324S3V3 Frequently Asked Questions (FAQs)

  • XP Power recommends a PCB layout with a large copper area connected to the module's thermal pad to dissipate heat efficiently. A minimum of 1 oz copper thickness is recommended, and the copper area should be at least 1 inch x 1 inch in size.
  • Yes, the ITP0324S3V3 is designed to withstand vibrations up to 10G peak acceleration, making it suitable for use in industrial and transportation applications. However, it's essential to ensure proper mounting and screw torque to prevent damage.
  • To ensure reliability, XP Power recommends derating the module's output power by 2.5% per degree Celsius above 40°C. Additionally, ensure good airflow around the module, and consider using a heat sink or thermal interface material to reduce thermal resistance.
  • XP Power recommends using a fuse with a rating of 2A to 5A, depending on the specific application and input voltage. The fuse should be able to handle the module's peak inrush current and provide adequate protection against overcurrent conditions.
  • Yes, the ITP0324S3V3 can be used in redundant or parallel configurations to achieve higher power output or improve system reliability. However, it's essential to ensure proper synchronization and control of the modules to prevent damage or instability.

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ITP0324S3V3 Overview

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