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ITS4141NHUMA1 - Infineon

Description: INFINEON - ITS4141NHUMA1 - IC, PROFET, PG-SOT223-4

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PCB Footprints
ITS4141NHUMA1 - Infineon PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - PG-SOT223
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3D Models
ITS4141NHUMA1 - Infineon  - 3D model - SOT223 (3-Pin) - PG-SOT223
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ITS4141NHUMA1 Details

  • Manufacturer Part Number:

    ITS4141NHUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223

  • Package Description:

    GREEN, PLASTIC, SOT-223, 4 PIN

  • Pin Count:

    4

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7.05

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    0.7 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.8 mm

  • Supply Voltage-Max:

    45 V

  • Supply Voltage-Min:

    12 V

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    MOS

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.3 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    150 µs

  • Turn-on Time:

    100 µs

  • Width:

    3.5 mm

ITS4141NHUMA1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to ensure efficient heat dissipation.
  • Use a thermal interface material (TIM) with a high thermal conductivity, ensure good thermal contact between the device and heat sink, and consider using a heat sink with a high thermal conductivity.
  • Use a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Avoid wave soldering or hand soldering, as they can cause damage to the device.
  • Store the devices in their original packaging or in a dry, ESD-protected environment. Avoid exposing the devices to moisture, extreme temperatures, or physical stress.
  • Use ESD-protected workstations, wear ESD-protective clothing, and handle the devices with ESD-protected tools. Ensure that the device is properly grounded during handling and assembly.

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ITS4141NHUMA1 Overview

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