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ITS428L2ATMA1 - Infineon

Description: Power Switch/Driver 1:1 N-Channel 5.8A PG-TO252-5-11

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ITS428L2ATMA1 - Infineon PCB footprint - Other - Other - ITS428L2ATMA1-4
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ITS428L2ATMA1 Details

  • Manufacturer Part Number:

    ITS428L2ATMA1

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-252

  • Package Description:

    GREEN, PLASTIC, TO-252, 5 PIN

  • Pin Count:

    4

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6.98

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PSSO-G4

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    1.8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-252

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.5 mm

  • Supply Voltage-Max:

    43 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.14 mm

  • Terminal Position:

    SINGLE

  • Turn-off Time:

    200 µs

  • Turn-on Time:

    200 µs

  • Width:

    6.22 mm

ITS428L2ATMA1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure efficient heat dissipation.
  • Ensure proper thermal management, use a heat sink or thermal pad, and follow the recommended PCB layout. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • Monitor the device's temperature, voltage, and current consumption. Also, implement over-temperature protection (OTP) and over-current protection (OCP) mechanisms to prevent damage.
  • Consult the application notes and reference designs provided by Infineon. Optimize the device's configuration, such as setting the correct voltage and current limits, and adjust the thermal management accordingly.
  • Follow the recommended soldering temperature profile and assembly guidelines provided in the datasheet. Use a soldering iron with a temperature range of 220°C to 240°C, and ensure the device is handled by trained personnel to prevent damage.

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ITS428L2ATMA1 Overview

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