TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
Interface IC Type:
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code:
R-PDSO-G20
JESD-609 Code:
e3
Length:
12.8 mm
Moisture Sensitivity Level:
3
Number of Functions:
4
Number of Terminals:
20
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-30 °C
Output Current Flow Direction:
SINK
Output Peak Current Limit-Nom:
0.7 A
Package Body Material:
PLASTIC/EPOXY
Package Code:
SOP
Package Equivalence Code:
SOP20,.4
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Qualification Status:
Not Qualified
Seated Height-Max:
2.65 mm
Supply Voltage-Max:
40 V
Supply Voltage-Min:
5.5 V
Supply Voltage-Nom:
12 V
Surface Mount:
YES
Temperature Grade:
COMMERCIAL EXTENDED
Terminal Finish:
Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
1.27 mm
Terminal Position:
DUAL
Turn-off Time:
270 µs
Turn-on Time:
250 µs
Width:
7.6 mm
ITS716GFUMA1 Frequently Asked Questions (FAQs)
A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
To ensure reliable operation in high-temperature environments, it is essential to follow the recommended thermal design guidelines, use a heat sink if necessary, and ensure good airflow around the device. Additionally, consider using a thermocouple or thermistor to monitor the device temperature.
Critical parameters to monitor for fault detection and diagnosis include voltage, current, temperature, and fault flags. Implementing a robust monitoring and diagnostic system can help detect faults early, reducing downtime and improving overall system reliability.
To optimize the device for low-power operation, consider using a low-power mode, reducing the switching frequency, and optimizing the gate driver circuitry. Additionally, ensure that the device is properly configured and that unnecessary features are disabled to minimize power consumption.
To protect the ITS716GFUMA1 from electrostatic discharge (ESD), use ESD-sensitive handling procedures, implement ESD protection devices such as TVS diodes or ESD arrays, and ensure that the PCB design includes ESD protection features such as guard rings and ESD-safe layout practices.
Trust Checks
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Community Provided
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System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
ITS716GFUMA1 Overview
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