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ITS724G - Infineon

Description: Infineon ITS724G, Quad Intelligent Power Switch, High Side, 7.3A, 5.5 → 40V, 20-Pin, SOIC

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PCB Footprints
ITS724G - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-20
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ITS724G - Infineon  - 3D model - Small Outline Packages - PG-DSO-20
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ITS724G Details

  • Manufacturer Part Number:

    ITS724G

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC, SOP-20

  • Pin Count:

    20

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    4

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    4

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    8.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    40 V

  • Supply Voltage-Min:

    5.5 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    270 µs

  • Turn-on Time:

    250 µs

  • Width:

    7.6 mm

ITS724G Frequently Asked Questions (FAQs)

  • Infineon recommends a PCB layout with a large copper area connected to the thermal pad of the ITS724G to ensure good heat dissipation. A minimum of 2oz copper thickness and a thermal via array under the device are also recommended.
  • To ensure reliability, it is essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, a thorough thermal design and validation should be performed to ensure the device operates within the specified temperature range.
  • When using the ITS724G, it is essential to consider EMI filtering to ensure electromagnetic compatibility. A pi-filter or a common-mode choke can be used to filter out high-frequency noise. Additionally, a good PCB layout with short traces and a solid ground plane can help reduce EMI emissions.
  • To troubleshoot issues with the ITS724G, start by checking the power supply voltage, input voltage, and output voltage. Verify that the device is operating within the recommended operating conditions. Use an oscilloscope to check for voltage spikes, noise, or oscillations. If the issue persists, consult the datasheet and application notes or contact Infineon's technical support.
  • The ITS724G's OCP feature is designed to protect the device from excessive current. However, it may also affect system design. Ensure that the system can handle the OCP threshold and that the device is properly sized for the application. Additionally, consider the impact of OCP on system startup and shutdown sequences.

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ITS724G Overview

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Buffer/Inverter Based Peripheral Driver, 4 Driver, 7.3A, MOS, PDSO20