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IXBOD1-08 - LITTELFUSE

Description: Sidacs 1 Amps 800V

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Symbol
IXBOD1-08 - LITTELFUSE - PCB symbol
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PCB Footprints
IXBOD1-08 - LITTELFUSE PCB footprint - Other - Other - FP-Case
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3D Models
IXBOD1-08 - LITTELFUSE - 3D model - Other - FP-Case
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IXBOD1-08 Details

  • Manufacturer Part Number:

    IXBOD1-08

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    0

  • Breakover Voltage-Max:

    800 V

  • Breakover Voltage-Min:

    750 V

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Holding Current-Max:

    30 mA

  • Holding Current-Nom:

    30 mA

  • JESD-30 Code:

    R-PSIP-T2

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Trigger Device Type:

    RVS BLOCKING BOD

IXBOD1-08 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the IXBOD1-08 involves keeping the device as close to the protected circuit as possible, using short and wide traces for the VCC and GND connections, and avoiding vias under the device to minimize inductance and noise.
  • The IXBOD1-08 is designed to handle overvoltage conditions by clamping the voltage to a safe level, protecting the downstream circuitry from damage. The device can withstand voltages up to 24V for a short duration.
  • The response time of the IXBOD1-08 to an overcurrent condition is typically in the range of 1-2 microseconds, allowing it to quickly respond to fault conditions and protect the circuit.
  • The IXBOD1-08 is rated for operation up to 125°C, making it suitable for use in high-temperature applications. However, the device's performance and reliability may be affected at extreme temperatures, and derating may be necessary.
  • The IXBOD1-08 is designed to have minimal impact on signal integrity, with a low capacitance of 0.5pF and a high bandwidth of 1GHz. However, the device's presence may still affect the signal rise time and amplitude, and simulation or testing may be necessary to ensure signal integrity.

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IXBOD1-08 Overview

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