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IXDD614SITR - LITTELFUSE

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IXDD614SITR - LITTELFUSE  - 3D model
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IXDD614SITR Details

  • Manufacturer Part Number:

    IXDD614SITR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8.1

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Peak Current Limit-Nom:

    14 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP8,.24

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Max:

    35 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    18 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.075 µs

  • Turn-on Time:

    0.075 µs

  • Width:

    3.9 mm

IXDD614SITR Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a thermal pad on the bottom of the device and connect it to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, keeping the PCB traces and vias away from the thermal pad can reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended derating curves for the device. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It is also crucial to ensure good airflow and avoid thermal hotspots.
  • The IXDD614SITR has built-in ESD protection, but it is still essential to follow proper handling and storage precautions to prevent damage. Use an anti-static wrist strap, mat, or packaging materials, and avoid touching the device's pins or exposed pads.
  • Yes, the IXDD614SITR is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q101 and is designed to operate in harsh environments. However, it is essential to follow the recommended operating conditions and ensure that the device is properly qualified for the specific application.
  • The recommended soldering profile for the IXDD614SITR is a peak temperature of 260°C (500°F) for a maximum of 10 seconds. It is essential to follow a controlled soldering process to prevent damage to the device.

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IXDD614SITR Overview

Use the download button to access the IXDD614SITR 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like IXDD6, or try a keyword search, such as MOSFET Drivers

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