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IXDF604SIA - LITTELFUSE

Description: Gate Drivers 4A Dual Low-Side Ultrafast Mosfet DRV

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IXDF604SIA - LITTELFUSE PCB footprint - Small Outline Packages - Small Outline Packages - IXDF604SIA
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IXDF604SIA Details

  • Manufacturer Part Number:

    IXDF604SIA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8.1

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    35 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    18 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.065 µs

  • Turn-on Time:

    0.065 µs

  • Width:

    3.9 mm

IXDF604SIA Frequently Asked Questions (FAQs)

  • For optimal performance, it is recommended to follow the PCB layout guidelines provided in the application note AN9311 from Littelfuse. This includes keeping the thermal pad connected to a solid copper plane, using a minimum of 2 oz copper thickness, and ensuring good airflow around the device. Additionally, it is recommended to use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K to improve heat dissipation.
  • To ensure proper soldering, it is recommended to follow the soldering guidelines provided in the application note AN9311 from Littelfuse. This includes using a soldering iron with a temperature range of 250°C to 260°C, a soldering time of 3-5 seconds, and a peak temperature of 260°C. It is also recommended to use a solder with a melting point of 217°C to 221°C and a flux that is compatible with the device's packaging.
  • The maximum allowed voltage transient for the IXDF604SIA is 80 V for a duration of 100 ms. To protect the device from voltage spikes, it is recommended to use a TVS (Transient Voltage Suppressor) diode with a voltage rating of at least 80 V and a response time of less than 1 ns. Additionally, it is recommended to use a capacitor with a voltage rating of at least 50 V and a capacitance value of 10 nF to 100 nF to filter out high-frequency noise.
  • To determine the correct current sense resistor value, you need to consider the maximum current rating of the device, the desired current sense accuracy, and the voltage drop across the sense resistor. A general rule of thumb is to choose a sense resistor value that results in a voltage drop of 50 mV to 100 mV at the maximum current rating. You can use the following formula to calculate the sense resistor value: Rsense = (Vdrop / Imax) * (Rds(on) / 2), where Vdrop is the desired voltage drop, Imax is the maximum current rating, and Rds(on) is the on-state resistance of the device.
  • The recommended gate drive voltage for the IXDF604SIA is 10 V to 15 V. To ensure proper gate drive circuitry, it is recommended to use a gate driver IC with a voltage rating of at least 15 V and a current rating of at least 1 A. Additionally, it is recommended to use a gate resistor with a value of 10 ohms to 22 ohms to limit the gate current and prevent ringing. It is also recommended to use a decoupling capacitor with a value of 10 nF to 100 nF to filter out high-frequency noise.

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