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IXDI609SI - LITTELFUSE

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IXDI609SI - LITTELFUSE  - 3D model
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IXDI609SI Details

  • Manufacturer Part Number:

    IXDI609SI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8.1

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    9 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    35 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    18 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    0.04 µs

  • Turn-on Time:

    0.055 µs

  • Width:

    3.9 mm

IXDI609SI Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a thermal pad on the bottom of the device and connect it to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, keeping the PCB traces and vias away from the thermal pad can reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended derating curves for the device. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It is also crucial to ensure good airflow and avoid thermal hotspots.
  • The IXDI609SI has built-in ESD protection, but it is still essential to follow proper handling and storage precautions to prevent damage. Use an anti-static wrist strap, mat, or packaging materials, and avoid touching the device's pins or exposed internal components.
  • Yes, the IXDI609SI is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q101 and is designed to operate in harsh environments. However, it is essential to follow the recommended operating conditions, and ensure that the device is properly qualified and validated for the specific application.
  • For optimal assembly and soldering, follow the recommended reflow soldering profile, and use a solder with a melting point above 217°C. Ensure that the PCB is clean and free of contaminants, and use a soldering iron with a temperature-controlled tip. Avoid applying excessive force or pressure during assembly.

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IXDI609SI Overview

Use the download button to access the IXDI609SI 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like IXDI6, or try a keyword search, such as MOSFET Drivers

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Part Image IXDI609SITR Littelfuse Inc

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Part Image IXDI609SI IXYS Corporation

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