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IXDN609SI - LITTELFUSE

Description: Gate Drivers 9-Ampere Low-Side Ultrafast MOSFET

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IXDN609SI - LITTELFUSE - PCB symbol
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PCB Footprints
IXDN609SI - LITTELFUSE PCB footprint - Small Outline Packages - Small Outline Packages - SI (8-Pin Power SOIC with Exposed Metal Back)
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3D Models
IXDN609SI - LITTELFUSE - 3D model - Small Outline Packages - SI (8-Pin Power SOIC with Exposed Metal Back)
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IXDN609SI Details

  • Manufacturer Part Number:

    IXDN609SI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8.1

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    9 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    35 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    18 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.04 µs

  • Turn-on Time:

    0.055 µs

  • Width:

    3.9 mm

IXDN609SI Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXDN609SI is a standard SOT23 package with a 5-pin configuration. The datasheet provides a recommended land pattern and soldering guidelines.
  • To ensure proper biasing, connect the input pin (pin 1) to a stable voltage source, and the output pin (pin 5) to a load or a voltage divider. The datasheet provides a typical application circuit and biasing guidelines.
  • The maximum allowable power dissipation for the IXDN609SI is 1.4W at an ambient temperature of 25°C. However, this value can be derated based on the operating temperature and other factors. Refer to the datasheet for thermal resistance and power dissipation calculations.
  • Yes, the IXDN609SI is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is manufactured with automotive-grade processes and materials.
  • The IXDN609SI has built-in ESD protection, but it's still important to follow proper ESD handling procedures when handling the device. Use an ESD wrist strap, mat, or workstation, and avoid touching the device's pins or leads.

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IXDN609SI Overview

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