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IXFH26N50P - LITTELFUSE

Description: MOSFET HiPERFET Id26 BVdass500

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Symbol
IXFH26N50P - LITTELFUSE - PCB symbol
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PCB Footprints
IXFH26N50P - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247+-
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3D Models
IXFH26N50P - LITTELFUSE - 3D model - Transistor Outline, Vertical - TO-247+-
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IXFH26N50P Details

  • Manufacturer Part Number:

    IXFH26N50P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    26 A

  • Drain-source On Resistance-Max:

    0.23 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    40 pF

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    400 W

  • Pulsed Drain Current-Max (IDM):

    78 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Element Material:

    SILICON

IXFH26N50P Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXFH26N50P is a standard SOT-227 package with a minimum pad size of 2.5mm x 2.5mm and a thermal pad size of 3.5mm x 3.5mm.
  • Yes, IXFH26N50P is rated for operation up to 150°C, but it's recommended to derate the current and voltage ratings according to the temperature derating curve provided in the datasheet.
  • To ensure reliability, follow proper soldering and assembly procedures, use a clean and dry environment, and avoid exceeding the recommended operating conditions. Additionally, consider using a fuse with a built-in thermal protection device (TPD) for added reliability.
  • Yes, IXFH26N50P is designed to withstand vibrations up to 10G, but it's recommended to follow proper mounting and securing procedures to ensure the fuse remains securely attached to the PCB.
  • Select a fuse value that is greater than the maximum expected current in your application, but less than the maximum current rating of the fuse. Consider factors such as inrush current, steady-state current, and fault current when selecting the fuse value.

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IXFH26N50P Overview

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