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IXFP36N20X3 - LITTELFUSE

Description: Trans MOSFET N-CH 200V 36A 3-Pin(3+Tab) TO-220

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Symbol
IXFP36N20X3 - LITTELFUSE - PCB symbol
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PCB Footprints
IXFP36N20X3 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220 Outline
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3D Models
IXFP36N20X3 - LITTELFUSE - 3D model - Transistor Outline, Vertical - TO-220 Outline
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IXFP36N20X3 Details

  • Manufacturer Part Number:

    IXFP36N20X3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.92

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    300 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    36 A

  • Drain-source On Resistance-Max:

    0.045 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    1.2 pF

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    170 W

  • Pulsed Drain Current-Max (IDM):

    50 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFP36N20X3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFP36N20X3 is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • While the IXFP36N20X3 is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz with proper PCB layout and design considerations. However, it's essential to consult with Littelfuse's application engineers for specific guidance.
  • To ensure proper cooling, it's recommended to provide a heat sink with a thermal resistance of ≤ 10°C/W and a minimum surface area of 10 cm². Additionally, ensure good airflow around the device and avoid blocking the heat sink fins.
  • The maximum allowed case temperature for the IXFP36N20X3 is 150°C. Operating the device above this temperature can reduce its lifespan and affect its performance.
  • Yes, the IXFP36N20X3 can be used in a parallel configuration to increase current handling. However, it's essential to ensure that the devices are properly matched and that the current sharing is balanced to avoid overheating and reduce the overall reliability of the system.

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IXFP36N20X3 Overview

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