The recommended PCB footprint for the IXTH1N200P3HV is a standard TO-220 package with a minimum pad size of 4.5mm x 4.5mm and a thermal pad diameter of 2.5mm.
Yes, the IXTH1N200P3HV is rated for operation up to 150°C, but derating is required for temperatures above 125°C. Consult the datasheet for specific derating guidelines.
The maximum surge current rating for the IXTH1N200P3HV is 100A for a 10ms pulse width. Consult the datasheet for specific surge current ratings and pulse widths.
Yes, the IXTH1N200P3HV is compatible with lead-free soldering processes and meets the RoHS and WEEE directives.
The typical turn-on time for the IXTH1N200P3HV is 10-20ns, and the typical turn-off time is 20-30ns. Consult the datasheet for specific timing characteristics.
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IXTH1N200P3HV Overview
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