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IXTH220N20X4 - LITTELFUSE

Description: N-Channel 200 V 220A (Tc) 800W (Tc) Through Hole ISO TO-247-3

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Symbol
IXTH220N20X4 - LITTELFUSE - PCB symbol
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PCB Footprints
IXTH220N20X4 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247 (IXTH)
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3D Models
IXTH220N20X4 - LITTELFUSE - 3D model - Transistor Outline, Vertical - TO-247 (IXTH)
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IXTH220N20X4 Details

  • Manufacturer Part Number:

    IXTH220N20X4

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    900 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    220 A

  • Drain-source On Resistance-Max:

    0.0055 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5.4 pF

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    800 W

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTH220N20X4 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTH220N20X4 is a TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm. It's recommended to follow the PCB layout guidelines provided in the datasheet or application notes.
  • The IXTH220N20X4 is rated for operation up to 150°C, but it's recommended to derate the device's power handling capability at higher temperatures. Consult the datasheet's thermal derating curve to determine the maximum power handling at your specific operating temperature.
  • Proper cooling is crucial for the IXTH220N20X4. Ensure good thermal contact between the device and a heat sink, and use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K. The heat sink should be designed to provide adequate airflow and have a thermal resistance of less than 1°C/W.
  • The IXTH220N20X4 has a maximum surge current rating of 440A for 10ms. This rating is based on the device's ability to withstand a single non-repetitive surge event. Consult the datasheet for more information on surge current ratings and limitations.
  • Yes, the IXTH220N20X4 can be used in a parallel configuration to increase the overall current handling capability. However, it's essential to ensure that the devices are properly matched and that the current sharing is balanced to prevent overheating and reduce the risk of thermal runaway.

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IXTH220N20X4 Overview

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