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IXTH240N15X4 - LITTELFUSE

Description: MOSFET, 240A, 150V, 940W, TO-247-3

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PCB Footprints
IXTH240N15X4 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247 (IXTH)
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3D Models
IXTH240N15X4 - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-247 (IXTH)
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IXTH240N15X4 Details

  • Manufacturer Part Number:

    IXTH240N15X4

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1200 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    240 A

  • Drain-source On Resistance-Max:

    0.0044 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    6 pF

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    940 W

  • Pulsed Drain Current-Max (IDM):

    420 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTH240N15X4 Frequently Asked Questions (FAQs)

  • The thermal resistance of the IXTH240N15X4 is typically around 0.5°C/W (junction-to-case) and 1.5°C/W (junction-to-ambient) when mounted on a standard PCB.
  • Yes, the IXTH240N15X4 is designed for high-reliability applications and is qualified to AEC-Q101 standards, which ensures it meets the stringent requirements for automotive and industrial applications.
  • To ensure proper soldering, follow the recommended soldering profile and use a solder with a melting point above 217°C (423°F). Also, make sure the device is properly aligned and seated on the PCB before soldering.
  • The recommended PCB layout for the IXTH240N15X4 includes a thermal pad on the bottom of the device, which should be connected to a copper plane on the PCB to improve thermal dissipation. Additionally, keep the PCB traces as short and wide as possible to minimize inductance and resistance.
  • The IXTH240N15X4 is designed for high-frequency applications up to 100 kHz. However, it's essential to consider the device's parasitic inductance and capacitance when designing the circuit to ensure optimal performance.

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IXTH240N15X4 Overview

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