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IXTK32P60P - LITTELFUSE

Description: MOSFET -32 Amps -600V 0.350 Rds

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PCB Footprints
IXTK32P60P - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-264 (IXTK)_1
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3D Models
IXTK32P60P - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-264 (IXTK)_1
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IXTK32P60P Details

  • Manufacturer Part Number:

    IXTK32P60P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.95

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    3500 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    600 V

  • Drain Current-Max (ID):

    32 A

  • Drain-source On Resistance-Max:

    0.35 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    77 pF

  • JEDEC-95 Code:

    TO-264AA

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    890 W

  • Pulsed Drain Current-Max (IDM):

    96 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTK32P60P Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTK32P60P is a rectangular pad with dimensions of 2.5mm x 1.5mm, with a 0.5mm radius corner and a 0.3mm spacing between pads.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder flux to the pads. Also, ensure the PCB is clean and free of oxidation.
  • The maximum surge current rating for the IXTK32P60P is 100A for 10/1000μs, as per the IEC 61000-4-5 standard.
  • Yes, the IXTK32P60P is rated for operation up to 150°C, but derating is required above 125°C. Consult the datasheet for specific derating curves.
  • To select the correct fuse, consider factors such as the maximum available fault current, the nominal operating current, and the required response time. Consult the datasheet and application notes for guidance.

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IXTK32P60P Overview

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