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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IXTN200N10T
- Part Number IXTN200N10T
- Manufacturer LITTELFUSE
- Pin Count 4
- Part Category MOSFET (N-Channel)
- Last Modified Date Mar 7, 2023 5:25 PM UTC
- Pinout / Pin List Click Here (Member Only)
IXTN200N10T Details
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Manufacturer Part Number:
IXTN200N10T
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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ECCN Code:
EAR99
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Manufacturer:
Littelfuse Inc
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Moisture Sensitivity Level:
1
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Peak Reflow Temperature (Cel):
260
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Terminal Finish:
Nickel (Ni)
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Time@Peak Reflow Temperature-Max (s):
10
IXTN200N10T Frequently Asked Questions (FAQs)
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The recommended PCB footprint for IXTN200N10T is a TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
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Yes, IXTN200N10T is rated for operation up to 150°C, but it's recommended to derate the current and voltage ratings according to the temperature derating curve provided in the datasheet.
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To ensure reliability, follow proper handling and storage procedures, use a clean and dry environment, and avoid exceeding the recommended operating conditions. Also, consider using a thermally conductive interface material and a heat sink to reduce thermal stress.
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Yes, but it's recommended to ensure that the devices are properly matched and that the current sharing is balanced. Also, consider the increased thermal stress and ensure proper heat sinking and thermal management.
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The recommended wire bonding technique for IXTN200N10T is ultrasonic wedge bonding using a 0.5mm to 1.0mm diameter aluminum or copper wire.
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IXTN200N10T Overview
Use the download button to access the IXTN200N10T 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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