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IXTT40N50L2 - LITTELFUSE

Description: N-Channel 500 V 40A (Tc) 540W (Tc) Surface Mount TO-268AA -55°C ~ 150°C (TJ)

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Symbol
IXTT40N50L2 - LITTELFUSE - PCB symbol
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PCB Footprints
IXTT40N50L2 - LITTELFUSE PCB footprint - Other - Other - TO-268 (IXTT)_2025-1.1
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3D Models
IXTT40N50L2 - LITTELFUSE - 3D model - Other - TO-268 (IXTT)_2025-1.1
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IXTT40N50L2 Details

  • Manufacturer Part Number:

    IXTT40N50L2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    2000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    40 A

  • Drain-source On Resistance-Max:

    0.17 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-268AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    540 W

  • Pulsed Drain Current-Max (IDM):

    80 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

IXTT40N50L2 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTT40N50L2 is a TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm. It's recommended to follow the PCB layout guidelines provided in the datasheet or application notes to ensure proper thermal performance and reliability.
  • To ensure proper cooling, it's recommended to provide a heat sink with a thermal resistance of less than 10°C/W. The heat sink should be mounted to the device using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K. Additionally, ensure good airflow around the device and heat sink to prevent thermal hotspots.
  • The maximum allowed case temperature for the IXTT40N50L2 is 150°C. Operating the device above this temperature can reduce its reliability and lifespan. It's recommended to design the system to keep the case temperature below 125°C to ensure optimal performance and reliability.
  • The IXTT40N50L2 is a commercial-grade device and may not meet the requirements for high-reliability or aerospace applications. Littelfuse Inc offers other devices that are specifically designed and qualified for these types of applications. It's recommended to contact Littelfuse Inc or a qualified distributor for more information on their high-reliability or aerospace-grade products.
  • The IXTT40N50L2 is an ESD-sensitive device and requires proper handling and storage to prevent damage. It's recommended to follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging. Additionally, ensure that the device is properly grounded during assembly and testing.

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IXTT40N50L2 Overview

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