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JAN1N6462US - Microchip

Description: 11V Clamp 258A (8/20µs) Ipp Tvs Diode Surface Mount B, SQ-MELF

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JAN1N6462US - Microchip PCB footprint - Other - Other - B SQ-MELF
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JAN1N6462US Details

  • Manufacturer Part Number:

    JAN1N6462US

  • Rohs Code:

    No

  • Part Life Cycle Code:

    Active

  • Package Description:

    MELF-2

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • Additional Feature:

    HIGH RELIABILITY, MIL-PRF-19500

  • Breakdown Voltage-Min:

    6.5 V

  • Case Connection:

    ISOLATED

  • Clamping Voltage-Max:

    11 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    1.5 V

  • JESD-30 Code:

    O-LELF-R2

  • JESD-609 Code:

    e0

  • Non-rep Peak Rev Power Dis-Max:

    500 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    GLASS

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Polarity:

    UNIDIRECTIONAL

  • Qualification Status:

    Qualified

  • Reference Standard:

    IEC-61000-4-2, 4-4, 4-5; MIL-STD-750

  • Rep Pk Reverse Voltage-Max:

    6 V

  • Reverse Current-Max:

    2500 µA

  • Reverse Test Voltage:

    6 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    WRAP AROUND

  • Terminal Position:

    END

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JAN1N6462US Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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