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JANTXV1N5614US - Microchip

Description: Rectifiers Rectifier

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JANTXV1N5614US - Microchip PCB footprint - Other - Other - JANTXV1N5614US-3
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JANTXV1N5614US Details

  • Manufacturer Part Number:

    JANTXV1N5614US

  • Part Life Cycle Code:

    Active

  • Package Description:

    HERMETIC SEALED, GLASS PACKAGE-2

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    35 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • Additional Feature:

    METALLURGICALLY BONDED

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • JESD-30 Code:

    O-LELF-R2

  • JESD-609 Code:

    e0

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Output Current-Max:

    1 A

  • Package Body Material:

    GLASS

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Qualification Status:

    Qualified

  • Reference Standard:

    MIL-19500/427K

  • Reverse Recovery Time-Max:

    2 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    WRAP AROUND

  • Terminal Position:

    END

JANTXV1N5614US Frequently Asked Questions (FAQs)

  • Microchip recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines. Additionally, consider using thermal interface materials (TIMs) to reduce thermal resistance between the device and the heat sink. Microchip also recommends derating the device's power dissipation according to the temperature derating curve provided in the datasheet.
  • Microchip recommends following the JEDEC J-STD-020D.1 standard for soldering conditions. The recommended peak reflow temperature is 260°C, with a maximum time above 217°C of 30 seconds. Hand soldering is not recommended, as it may cause damage to the device.
  • To prevent ESD damage, handle the devices with ESD-protective materials, such as wrist straps, mats, and bags. Ensure that the assembly line and storage areas are ESD-protected, and follow proper grounding procedures during assembly. Microchip also recommends using ESD-protected devices and components in the surrounding circuitry.
  • Microchip recommends storing the devices in their original packaging, in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to 125°C, with a relative humidity of 60% or less.

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JANTXV1N5614US Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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