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JANTXV1N5620 - Microchip

Description: Rectifiers Rectifier

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PCB Footprints
JANTXV1N5620 - Microchip PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - JANTXV1N5620-1
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JANTXV1N5620 Details

  • Manufacturer Part Number:

    JANTXV1N5620

  • Rohs Code:

    No

  • Part Life Cycle Code:

    Active

  • Package Description:

    HERMETIC SEALED, GLASS, A PACKAGE-2

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    35 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • JESD-30 Code:

    O-LALF-W2

  • JESD-609 Code:

    e0

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    200 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    GLASS

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Qualification Status:

    Qualified

  • Reference Standard:

    MIL-19500

  • Rep Pk Reverse Voltage-Max:

    800 V

  • Reverse Recovery Time-Max:

    2 µs

  • Surface Mount:

    NO

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

JANTXV1N5620 Frequently Asked Questions (FAQs)

  • Microchip recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines. Additionally, consider using a thermal interface material (TIM) between the device and the heat sink, and ensure that the device is operated within its specified temperature range.
  • Microchip recommends soldering the JANTXV1N5620 using a reflow soldering process with a peak temperature of 260°C (500°F) for a maximum of 20 seconds. The device should be soldered using a solder with a melting point of 217°C (423°F) or higher.
  • To prevent ESD damage, handle the device by the body or pins, avoid touching the pins or die, and use an ESD wrist strap or mat during assembly. Ensure that the device is stored in an ESD-protected package or bag when not in use.
  • The JANTXV1N5620 is designed to be radiation-hardened, which means it can withstand certain levels of radiation without significant performance degradation. However, the device's performance may still be affected by radiation, and it's essential to consult the datasheet and radiation reports for specific details on the device's radiation hardness.

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JANTXV1N5620 Overview

Use the download button to access the JANTXV1N5620 schematic symbol and PCB footprint.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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For a full list of alternate parts for JANTXV1N5620, check out Findchips.com