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K32L2B11VFM0A - NXP

Description: MCU 32-bit ARM Cortex M0+ RISC 64KB Flash 2.5V/3.3V 32-Pin HUQFN EP Tray

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PCB Footprints
K32L2B11VFM0A - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 32-pin QFN
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3D Models
K32L2B11VFM0A - NXP  - 3D model - Quad Flat No-Lead - 32-pin QFN
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K32L2B11VFM0A Details

  • Manufacturer Part Number:

    K32L2B11VFM0A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-32

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    13 Weeks

  • Date Of Intro:

    2019-11-28

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    CORTEX-M0

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    4

  • Number of I/O Lines:

    23

  • Number of Serial I/Os:

    3

  • Number of Terminals:

    32

  • Number of Timers:

    12

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    32768

  • ROM (words):

    65536

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    0.65 mm

  • Speed:

    48 MHz

  • Supply Current-Max:

    9.03 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

K32L2B11VFM0A Frequently Asked Questions (FAQs)

  • The recommended crystal oscillator frequency for the K32L2B11VFM0A is 32.768 kHz, which is the typical frequency used for real-time clock (RTC) applications.
  • To configure the K32L2B11VFM0A for low-power mode, you need to set the VLLS (Very Low Leakage Stop) mode, which can be done by writing to the PMC (Power Management Controller) registers. You can also use the MCU's power management APIs to simplify the process.
  • The maximum operating temperature range for the K32L2B11VFM0A is -40°C to 105°C, making it suitable for industrial and automotive applications.
  • Yes, the K32L2B11VFM0A has an external memory interface that supports up to 32-bit wide external memory, allowing you to expand the MCU's memory capabilities.
  • To implement secure boot on the K32L2B11VFM0A, you need to use the MCU's boot ROM and configure the flash memory to use the secure boot feature. You can also use NXP's Secure Bootloader software to simplify the process.

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K32L2B11VFM0A Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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