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K32L2B11VMP0A - NXP

Description: ARM® Cortex®-M0+ K32 L2 Microcontroller IC 32-Bit Single-Core 48MHz 64KB (64K x 8) FLASH 64-MAPBGA (5x5)

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PCB Footprints
K32L2B11VMP0A - NXP PCB footprint - BGA - BGA - LFBGA64, plastic, low profile fine-pitch ball grid array; 64 bumps; 0.5 mm pitch; 5 mm x 5 mm x 1.23 mm
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3D Models
K32L2B11VMP0A - NXP  - 3D model - BGA - LFBGA64, plastic, low profile fine-pitch ball grid array; 64 bumps; 0.5 mm pitch; 5 mm x 5 mm x 1.23 mm
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for K32L2B11VMP0A
  • Part Number K32L2B11VMP0A
  • Manufacturer NXP
  • Pin Count 64
  • Part Category Integrated Circuit
  • Package Category BGA
  • Footprint Name BGA - LFBGA64, plastic, low profile fine-pitch ball grid array; 64 bumps; 0.5 mm pitch; 5 mm x 5 mm x 1.23 mm
  • Released Date Jun 27, 2025
  • Last Modified Date Jun 27, 2025 11:29 AM UTC
  • Pinout / Pin List Click Here (Member Only)

K32L2B11VMP0A Details

  • Manufacturer Part Number:

    K32L2B11VMP0A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MAPBGA-64

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Date Of Intro:

    2019-11-28

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    CORTEX-M0

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PBGA-B64

  • JESD-609 Code:

    e1

  • Length:

    5 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    4

  • Number of I/O Lines:

    50

  • Number of Serial I/Os:

    3

  • Number of Terminals:

    64

  • Number of Timers:

    12

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA64,8X8,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    32768

  • ROM (words):

    65536

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.23 mm

  • Speed:

    48 MHz

  • Supply Current-Max:

    9.03 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

K32L2B11VMP0A Frequently Asked Questions (FAQs)

  • The recommended crystal oscillator frequency for the K32L2B11VMP0A is 32.768 kHz, which is the typical frequency used for real-time clock (RTC) applications.
  • To configure the K32L2B11VMP0A's power modes, you can use the Power Management Controller (PMC) to select from various power modes, such as Run, Wait, Stop, and VLP (Very Low Power) modes. You can also use the Low Power Mode (LPM) to reduce power consumption further.
  • The maximum operating temperature range for the K32L2B11VMP0A is -40°C to 105°C, making it suitable for industrial and automotive applications.
  • To implement secure boot on the K32L2B11VMP0A, you can use the BootROM's secure boot feature, which verifies the authenticity of the firmware using digital signatures. You can also use the Cryptographic Acceleration Unit (CAU) to accelerate cryptographic operations.
  • The maximum clock frequency for the K32L2B11VMP0A's CPU is 100 MHz, which provides a high-performance processing capability for demanding applications.

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K32L2B11VMP0A Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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