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KBU1010-G - Comchip Technology

Description: Bridge Rectifiers KBU CELL 10A 1000V Rect. Bridge Diode

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KBU1010-G - Comchip Technology PCB footprint - Other - Other - KBU1010-G_1
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KBU1010-G - Comchip Technology  - 3D model - Other - KBU1010-G_1
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KBU1010-G Details

  • Manufacturer Part Number:

    KBU1010-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Comchip Technology Corporation Ltd

  • YTEOL:

    3

  • Additional Feature:

    UL RECOGNIZED

  • Breakdown Voltage-Min:

    1000 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PSIP-W4

  • Non-rep Pk Forward Current-Max:

    240 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Surface Mount:

    NO

  • Terminal Form:

    WIRE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

KBU1010-G Frequently Asked Questions (FAQs)

  • The recommended soldering temperature for the KBU1010-G is between 250°C to 260°C for a maximum of 10 seconds.
  • No, the KBU1010-G is a standard recovery rectifier diode, not suitable for high-frequency switching applications. It's designed for general-purpose rectification and low-frequency switching.
  • The maximum allowable voltage for the KBU1010-G is 100V, as specified in the datasheet. Exceeding this voltage may damage the device.
  • To ensure proper heat-sinking, use a heat sink with a thermal resistance of ≤ 10°C/W, and apply a thin layer of thermal interface material (TIM) between the diode and heat sink.
  • Yes, the KBU1010-G can be used in parallel to increase current handling, but ensure that each diode has its own heat sink and that the current sharing is balanced to prevent overheating.

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