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KBU808-G - Comchip Technology

Description: Silicon Bridge Rectifiers ,50 to 1000V,8.0A

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KBU808-G - Comchip Technology - PCB symbol
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KBU808-G - Comchip Technology PCB footprint - Other - Other - KBU
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KBU808-G - Comchip Technology - 3D model - Other - KBU
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KBU808-G Details

  • Manufacturer Part Number:

    KBU808-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    R-PSFM-W4

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Comchip Technology Corporation Ltd

  • YTEOL:

    0.4

  • Breakdown Voltage-Min:

    800 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PSFM-W4

  • Non-rep Pk Forward Current-Max:

    200 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    800 V

  • Surface Mount:

    NO

  • Terminal Form:

    WIRE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

KBU808-G Frequently Asked Questions (FAQs)

  • The recommended soldering temperature for the KBU808-G is between 250°C to 260°C for a maximum of 10 seconds.
  • While the KBU808-G can be used in high-frequency applications, its performance may degrade above 100 kHz due to internal capacitance and inductance. It's recommended to use a more suitable diode for high-frequency applications.
  • To ensure proper cooling, provide adequate heat sinking, and consider the thermal resistance of the diode and the PCB. A thermal pad or heat sink can be used to dissipate heat. Follow the recommended mounting and thermal management guidelines in the datasheet.
  • The maximum surge current rating for the KBU808-G is 100 A for a single cycle, with a pulse width of 10 ms and a frequency of 60 Hz.
  • Yes, you can use multiple KBU808-G diodes in parallel to increase current handling, but ensure that each diode has its own heat sink and that the current is evenly distributed among the diodes.

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