ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including derating the output current and voltage according to the temperature. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature.
ROHM recommends using a low-ESR ceramic capacitor (X5R or X7R dielectric) with a value of 10uF to 22uF, depending on the input voltage and output current requirements. The capacitor should be placed as close to the VIN pin as possible to minimize noise and ripple.
To troubleshoot output voltage instability or oscillation issues, check the input voltage, output current, and PCB layout for any signs of noise or resonance. Ensure that the input capacitor is properly sized and placed, and that the output capacitor is suitable for the output voltage and current. Also, verify that the feedback network is properly configured and that the compensation components are correctly selected.
ROHM recommends using a low-ESR ceramic capacitor (X5R or X7R dielectric) with a value of 10uF to 47uF, depending on the output voltage and current requirements. The capacitor should be placed as close to the VOUT pin as possible to minimize noise and ripple.
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