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KLM8G1WEMB-B031 - SAMSUNG

Description: Samsung e·MMC Product family e.MMC 5.0 Specification compatibilitySAMSUNG e·MMC is an embedded MMC solution designed in a BGA package form. e·MMC operation is identical to a MMC device and therefore is a simple read and write to memory using MMC protocol v5.0 which is a industry standard.

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KLM8G1WEMB-B031 - SAMSUNG - PCB symbol

PCB Footprints

KLM8G1WEMB-B031 - SAMSUNG PCB footprint - BGA - BGA - 153 BEGA

3D Models

KLM8G1WEMB-B031 - SAMSUNG - 3D model - BGA - 153 BEGA

Datasheet Download Datasheet
Stock & Prices Price & Stock for KLM8G1WEMB-B031
Part Number KLM8G1WEMB-B031
Manufacturer SAMSUNG
Pin Count 153
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - 153 BEGA
Released Date May 4, 2020
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

KLM8G1WEMB-B031 Details

Manufacturer Part Number:
KLM8G1WEMB-B031
Manufacturer:
Samsung Electro-Mechanics

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