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KP215F1701XTMA1 - Infineon

Description: KP215F1701XTMA1, Absolute Pressure Sensor, 115 kPa, 1150 mbar 0.1 → 4.85 V Output, 8-Pin DSOF

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Symbol
KP215F1701XTMA1 - Infineon - PCB symbol
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PCB Footprints
KP215F1701XTMA1 - Infineon PCB footprint - Other - Other - PG-DSOF-8--16
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3D Models
KP215F1701XTMA1 - Infineon - 3D model - Other - PG-DSOF-8--16
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KP215F1701XTMA1 Details

  • Manufacturer Part Number:

    KP215F1701XTMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    GREEN, PLASTIC, SOF-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    11

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-PDSO-F8

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    140 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOF

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Seated Height-Max:

    2.9 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    FLAT

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    7 mm

KP215F1701XTMA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider using a thermocouple or thermistor to monitor the device temperature.
  • Handle the device in an ESD-protected environment, use ESD-safe packaging and tools, and ensure that all personnel handling the device are grounded using wrist straps or heel straps.
  • Yes, but ensure that you follow the recommended design and testing guidelines for high-reliability or safety-critical applications, and consult with Infineon's application engineers for specific guidance.
  • Use a logic analyzer or oscilloscope to capture waveforms, check the device's operating conditions, and consult the datasheet and application notes for troubleshooting guidelines.

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KP215F1701XTMA1 Overview

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