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KSZ8041TL - Microchip

Description: MICROCHIP - KSZ8041TL - ETHERNET TRANSCEIVER, 10/100MBPS, TQFP48

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KSZ8041TL - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - TQFP 48_2
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KSZ8041TL - Microchip  - 3D model - Quad Flat Packages - TQFP 48_2
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KSZ8041TL Details

  • Manufacturer Part Number:

    KSZ8041TL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TQFP-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    TQFP-48

  • Country Of Origin:

    Taiwan, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8517.70.00.00

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Data Rate:

    100000 Mbps

  • JESD-30 Code:

    S-PQFP-G48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP48,.35SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    58.3 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Telecom IC Type:

    ETHERNET TRANSCEIVER

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

KSZ8041TL Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the KSZ8041TL involves placing the device near the RJ-45 connector, using a solid ground plane, and minimizing the length of the traces between the device and the magnetics. A 4-layer PCB is recommended, with the top layer for signals, the second layer for the ground plane, the third layer for power, and the bottom layer for the ground plane.
  • To ensure reliable operation of the KSZ8041TL in high-temperature environments, it is recommended to follow proper thermal design guidelines, such as providing adequate heat sinking, using a thermally conductive PCB material, and ensuring good airflow around the device. Additionally, the device should be operated within its specified temperature range of -40°C to 85°C.
  • The KSZ8041TL is designed to meet the EMI and RFI requirements of the IEEE 802.3 standard. To minimize EMI and RFI, it is recommended to use a shielded RJ-45 connector, keep the PCB layout compact, and use a common-mode choke or ferrite bead on the Ethernet cables. Additionally, the device should be placed in a metal enclosure to reduce radiation.
  • To troubleshoot issues with the KSZ8041TL, it is recommended to follow a systematic approach, starting with checking the power supply, clock, and reset signals. Then, verify the Ethernet link status, packet transmission, and reception. Use diagnostic tools such as packet sniffers, logic analyzers, and oscilloscopes to identify the root cause of the issue.
  • The KSZ8041TL requires a specific power sequencing to ensure proper operation. The recommended power-up sequence is: 1) power up the 3.3V supply, 2) power up the 1.2V supply, and 3) apply the clock signal. The power-down sequence should be reversed. It is also recommended to use a power-on reset circuit to ensure a clean reset signal.

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KSZ8041TL Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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