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KSZ8061MNXI - Microchip

Description: PHY 10Mbps/100Mbps 3.135V to 3.465V Automotive 32-Pin QFN EP Tray

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KSZ8061MNXI - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN55-32LD-PL-1_2022
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3D Models
KSZ8061MNXI - Microchip  - 3D model - Quad Flat No-Lead - QFN55-32LD-PL-1_2022
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KSZ8061MNXI Details

  • Manufacturer Part Number:

    KSZ8061MNXI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    32

  • Manufacturer Package Code:

    VQFN-32

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8517.70.00.00

  • Factory Lead Time:

    23 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Data Rate:

    100000 Mbps

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    ETHERNET TRANSCEIVER

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

KSZ8061MNXI Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the KSZ8061MNXI involves placing the device near the RJ-45 connector, using a solid ground plane, and minimizing the length of the traces between the device and the magnetics. A 4-layer PCB is recommended, with the top layer for signals, the second layer for the power plane, the third layer for the ground plane, and the bottom layer for the signals.
  • The KSZ8061MNXI can be configured for half-duplex or full-duplex operation by setting the appropriate registers. For half-duplex operation, set the HDX pin high and the FDX pin low. For full-duplex operation, set the HDX pin low and the FDX pin high.
  • The KSZ8061MNXI supports cable lengths up to 100 meters, as specified in the IEEE 802.3u standard.
  • The KSZ8061MNXI has a built-in power management feature that can be controlled through the PMEDEN pin. To implement power management, connect the PMEDEN pin to a GPIO pin on the host processor and use the processor to control the power state of the device.
  • The recommended crystal oscillator frequency for the KSZ8061MNXI is 25 MHz, which is the default frequency for the device.

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KSZ8061MNXI Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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