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KSZ8873FLL - Microchip

Description: Ethernet Switch 100 Base-FX PHY I2C, SPI Interface 64-LQFP (10x10)

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KSZ8873FLL - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - 64-LEAD LQFP 10 MM X 10 MM
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KSZ8873FLL - Microchip  - 3D model - Quad Flat Packages - 64-LEAD LQFP 10 MM X 10 MM
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KSZ8873FLL Details

  • Manufacturer Part Number:

    KSZ8873FLL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    64

  • Manufacturer Package Code:

    LQFP-64

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    5A991.B.1

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100; TS 16949

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    LAN SWITCHING CIRCUIT

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

KSZ8873FLL Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the KSZ8873FLL involves placing the device near the RJ-45 connector, using a solid ground plane, and minimizing the length of the traces between the device and the magnetics. A 4-layer PCB is recommended, with the top layer for signals, the second layer for the power plane, the third layer for the ground plane, and the bottom layer for the signals.
  • The KSZ8873FLL can be configured using the SPI interface. The device has several registers that control its behavior, such as the PHY control register, the MAC control register, and the station address register. The configuration process involves writing the desired values to these registers using the SPI interface.
  • The power-up sequence for the KSZ8873FLL involves applying power to the device, waiting for the internal voltage regulator to stabilize, and then bringing the reset pin high. The power-down sequence involves bringing the reset pin low, waiting for the internal voltage regulator to discharge, and then removing power from the device.
  • Troubleshooting issues with the KSZ8873FLL involves checking the power supply, the clock signal, and the reset signal. It also involves verifying that the device is properly configured and that the firmware is functioning correctly. A logic analyzer or oscilloscope can be used to debug the SPI interface and the Ethernet signals.
  • The KSZ8873FLL has a maximum junction temperature of 150°C. The device should be mounted on a PCB with a solid ground plane to help dissipate heat. A heat sink may be required for high-temperature applications. The device should also be operated within the recommended operating temperature range of 0°C to 70°C.

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KSZ8873FLL Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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