KSZ8893MBL - Microchip

KSZ8893MBL Details

• Manufacturer Part Number:

  KSZ8893MBL

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  LFBGA-100

• Pin Count:

  100

• Manufacturer Package Code:

  LFBGA-100

• Country Of Origin:

  Taiwan

• ECCN Code:

  5A991.B.1

• HTS Code:

  8542.39.00.01

• Factory Lead Time:

  15 Weeks

• Manufacturer:

  Microchip Technology Inc

• YTEOL:

  0

• Data Rate:

  100000 Mbps

• JESD-30 Code:

  S-PBGA-B100

• JESD-609 Code:

  e1

• Length:

  9 mm

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  100

• Number of Transceivers:

  2

• Operating Temperature-Max:

  70 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Equivalence Code:

  BGA100,10X10,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Screening Level:

  TS 16949

• Seated Height-Max:

  1.38 mm

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  YES

• Telecom IC Type:

  LAN SWITCHING CIRCUIT

• Temperature Grade:

  COMMERCIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  9 mm