FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
Seated Height-Max:
1.2 mm
Supply Voltage-Nom:
1.2 V
Surface Mount:
YES
Telecom IC Type:
ETHERNET SWITCH
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
0.4 mm
Terminal Position:
QUAD
Width:
14 mm
KSZ9477STXI-TR Frequently Asked Questions (FAQs)
The recommended PCB layout for the KSZ9477STXI-TR can be found in the Microchip application note AN-2054, which provides guidelines for PCB design, layout, and thermal considerations.
The KSZ9477STXI-TR can be configured for specific network topologies using the Microchip LANCheck online tool or by consulting the device's datasheet and application notes. The tool provides a graphical interface to configure the device for various network topologies, including star, bus, and ring configurations.
The KSZ9477STXI-TR has a maximum junction temperature of 150°C. To ensure reliable operation, it is essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interfaces, and ensuring good airflow around the device.
To troubleshoot issues with the KSZ9477STXI-TR, start by consulting the device's datasheet and application notes. Check for proper power supply, clock signal, and reset signal connections. Use oscilloscopes or logic analyzers to verify signal integrity and timing. If issues persist, contact Microchip technical support for further assistance.
The KSZ9477STXI-TR is designed to meet EMI and EMC standards. To ensure compliance, follow proper PCB design and layout practices, use shielding and filtering as needed, and consult the device's datasheet and application notes for specific guidance.
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KSZ9477STXI-TR Overview
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About Microchip
Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th
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