ROHM recommends a thermal pad size of 2.5mm x 2.5mm with a thermal via diameter of 0.3mm, and a minimum of 5 thermal vias. Additionally, a solid copper pour on the top and bottom layers can help improve thermal dissipation.
To ensure reliable operation, follow the recommended operating temperature range of -40°C to 125°C. Implement proper thermal management, such as heat sinks or thermal interfaces, and ensure good airflow around the device. Also, consider derating the device's power dissipation according to the ambient temperature.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time above 240°C of 30-60 seconds, and a total process time of 60-120 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device.
The KTR18EZPJ184 requires a specific power sequencing to prevent damage. Ensure that the input voltage (VIN) is applied before the enable signal (EN), and that the output voltage (VOUT) is stable before applying the load. A soft-start circuit can help with power sequencing and reduce inrush currents.
ROHM recommends using ceramic capacitors with a minimum capacitance of 4.7μF for the input capacitor (CIN) and 10μF for the output capacitor (COUT). The capacitor's ESR should be less than 100mΩ, and the voltage rating should be at least 1.5 times the maximum input voltage.
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KTR18EZPJ184 Overview
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