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KTR18EZPJ331 - ROHM Semiconductor

Description: Thick Film Resistors - SMD 1206 330ohm 5% High VoltageAEC-Q200

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KTR18EZPJ331 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - KTR18
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KTR18EZPJ331 - ROHM Semiconductor  - 3D model - Resistor Chip - KTR18
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KTR18EZPJ331 Details

  • Manufacturer Part Number:

    KTR18EZPJ331

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    330 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    500 V

KTR18EZPJ331 Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad size of 2.5mm x 2.5mm with a thermal via diameter of 0.3mm, and a minimum of 5 thermal vias. Additionally, a solid copper fill on the top and bottom layers can help improve thermal dissipation.
  • To ensure reliable operation, follow the recommended derating curves for the device, and consider using a heat sink or thermal interface material to reduce the junction temperature. Also, ensure that the PCB is designed to withstand the operating temperature range.
  • ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a cooling rate of 3-5°C/s. It's essential to follow the recommended profile to prevent damage to the component.
  • While the KTR18EZPJ331 is a robust component, it's essential to ensure that the PCB is designed to withstand the vibration environment. Consider using a secure mounting method, such as screwing or adhesive, and ensure that the PCB is properly secured to the system.
  • ROHM recommends using an ESD protection device, such as a TVS diode, in parallel with the KTR18EZPJ331 to protect it from electrostatic discharge. Additionally, follow proper handling and storage procedures to prevent ESD damage.

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KTR18EZPJ331 Overview

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Part Image 232279061331L YAGEO Corporation

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 330ohm, 500V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 1206, CHIP

Part Image RH12JTN331 TA-I Technology Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 330ohm, 500V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 1206