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L6004L5TP - LITTELFUSE

Description: TRIAC Logic - Sensitive Gate 600 V 4 A Through Hole TO-220 Isolated Tab

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Symbol
L6004L5TP - LITTELFUSE - PCB symbol
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PCB Footprints
L6004L5TP - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB (L-Package)
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3D Models
L6004L5TP - LITTELFUSE - 3D model - Transistor Outline, Vertical - TO-220AB (L-Package)
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L6004L5TP Details

  • Manufacturer Part Number:

    L6004L5TP

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AB

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • DC Gate Trigger Current-Max:

    5 mA

  • DC Gate Trigger Voltage-Max:

    1.3 V

  • Holding Current-Max:

    10 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    0.2 mA

  • Moisture Sensitivity Level:

    2

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • On-State Voltage-Max:

    1.6 V

  • Operating Temperature-Max:

    110 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    4 A

  • Reference Standard:

    UL RECOGNIZED

  • Repetitive Peak Off-state Leakage Current-Max:

    200 µA

  • Repetitive Peak Off-state Voltage:

    600 V

  • Repetitive Peak Reverse Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Trigger Device Type:

    TRIAC

L6004L5TP Frequently Asked Questions (FAQs)

  • Littelfuse recommends a PCB layout with a large copper area connected to the thermal pad of the device to dissipate heat efficiently. A minimum of 1 oz copper thickness and a thermal relief pattern around the thermal pad are also recommended.
  • Yes, the L6004L5TP is a qualified device for high-reliability applications. It meets the requirements of AEC-Q101 and is manufactured in accordance with IATF 16949 and ISO 9001 standards.
  • Littelfuse recommends following the recommended soldering profile and using a solder with a melting point above 217°C (423°F) to ensure reliable connections. Additionally, a soldering iron with a temperature control and a soldering time of less than 3 seconds per pin is recommended.
  • The L6004L5TP has a maximum surge current rating of 100 A for 10 ms, making it suitable for applications with high inrush currents.
  • Yes, the L6004L5TP can be used in a parallel configuration to increase the current rating. However, it is essential to ensure that the devices are properly matched and that the PCB layout is designed to minimize current imbalance and thermal mismatch.

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L6004L5TP Overview

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