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L6375D013TR - STMicroelectronics

Description: 0.5A Industrial Intelligent Power Switch

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L6375D013TR - STMicroelectronics - PCB symbol
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L6375D013TR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-20 mechanical data
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L6375D013TR - STMicroelectronics - 3D model - Small Outline Packages - SO-20 mechanical data
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L6375D013TR Details

  • Manufacturer Part Number:

    L6375D013TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-20

  • Pin Count:

    20

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Built-in Protections:

    OVER CURRENT; THERMAL; UNDER VOLTAGE

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    12.8 mm

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • Output Current Flow Direction:

    SOURCE

  • Output Peak Current Limit-Nom:

    1.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    35 V

  • Supply Voltage-Min:

    8 V

  • Supply Voltage-Nom:

    24 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    7.5 mm

L6375D013TR Frequently Asked Questions (FAQs)

  • A good PCB layout for the L6375D013TR should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour connectivity to dissipate heat. Avoid routing critical signals under the device to minimize thermal resistance.
  • To ensure reliable operation at high temperatures, follow the recommended operating conditions, and consider derating the device's power dissipation according to the temperature derating curve in the datasheet. Also, ensure good thermal design and heat sinking to keep the junction temperature within the recommended range.
  • The critical timing parameters for the L6375D013TR include the switching frequency, rise and fall times, and dead time. Ensure that your design meets the recommended timing parameters to avoid shoot-through, ringing, and other issues that can affect device reliability and performance.
  • To protect the L6375D013TR from overvoltage and overcurrent, use a suitable voltage regulator or overvoltage protection circuit, and consider adding overcurrent protection devices such as fuses or current-sensing resistors. Also, ensure that your design meets the recommended operating conditions and follows the datasheet's guidelines for overvoltage and overcurrent protection.
  • For testing and measuring the L6375D013TR, use a suitable test fixture and follow the recommended test procedures outlined in the datasheet. Ensure that your test equipment is properly calibrated, and use proper probing techniques to avoid damaging the device or affecting measurement accuracy.

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L6375D013TR Overview

Use the download button to access the L6375D013TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like L6375, or try a keyword search, such as Peripheral Drivers

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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