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L6981N50DR - STMicroelectronics

Description: 38 V, 1.5 A synchronous step-down converter with 20 μA quiescent current

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L6981N50DR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO 8L
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L6981N50DR Details

  • Manufacturer Part Number:

    L6981N50DR

  • Brand Name:

    STMicroelectronics

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    38 V

  • Input Voltage-Min:

    3.5 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1.5 A

  • Output Voltage-Max:

    38 V

  • Output Voltage-Min:

    0.85 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.75 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    440 kHz

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

L6981N50DR Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the L6981N50DR is -40°C to 150°C, as specified in the datasheet. However, it's recommended to operate the device within a temperature range of -20°C to 125°C for optimal performance and reliability.
  • To ensure proper thermal management, it's essential to provide a good thermal path from the device to a heat sink or the PCB. Use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and ensure the heat sink is properly attached to the device. Additionally, consider using a thermal pad or a heat spreader to dissipate heat more efficiently.
  • For optimal performance and thermal management, it's recommended to follow a 4-layer PCB layout with a dedicated power plane, a dedicated ground plane, and two signal layers. Keep the power traces as short and wide as possible, and use vias to connect the power plane to the device pins. Also, ensure the decoupling capacitors are placed close to the device pins.
  • When selecting an output capacitor for the L6981N50DR, consider the following factors: capacitance value, equivalent series resistance (ESR), and voltage rating. A general rule of thumb is to use a capacitor with a capacitance value of at least 10 μF, an ESR of less than 100 mΩ, and a voltage rating of at least 1.5 times the output voltage. X5R or X7R ceramic capacitors are good options.
  • For the L6981N50DR, it's recommended to use a high-quality input capacitor with a capacitance value of at least 10 μF, an ESR of less than 100 mΩ, and a voltage rating of at least 1.5 times the input voltage. A ceramic capacitor with an X5R or X7R dielectric is a good option. Place the input capacitor close to the device pins and ensure it's connected to the input voltage rail.

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L6981N50DR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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