Littelfuse recommends a PCB layout with a large copper area connected to the thermal pad to dissipate heat efficiently. A minimum of 1 oz copper thickness and a thermal relief pattern around the thermal pad are also recommended.
Yes, the L70QS500.X is designed to meet the requirements of high-reliability and aerospace applications. However, it's essential to consult with Littelfuse's application engineers to ensure the device meets the specific requirements of your application.
Littelfuse recommends following the recommended soldering profile and using a solder with a melting point above 217°C (423°F) to ensure reliable connections. Additionally, a soldering iron with a temperature control and a soldering time of less than 3 seconds per pin is recommended.
The L70QS500.X has a surge current rating of 500 A for 10/1000 μs, which is higher than the standard 8/20 μs rating. This makes it suitable for applications with high surge currents.
Yes, the L70QS500.X can be used in a parallel configuration to increase the current rating. However, it's essential to ensure that the devices are properly matched and that the PCB layout is designed to minimize current imbalance and thermal mismatch.
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L70QS500.X Overview
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