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L9339-TR - STMicroelectronics

Description: Quad low side driver

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L9339-TR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO20-
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L9339-TR Details

  • Manufacturer Part Number:

    L9339-TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-20

  • Pin Count:

    20

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    3

  • Additional Feature:

    TTL AND CMOS COMPATIBLE INPUTS

  • Built-in Protections:

    TRANSIENT; THERMAL

  • Driver Number of Bits:

    4

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    0.7 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    32 V

  • Supply Voltage-Min:

    4.5 V

  • Surface Mount:

    YES

  • Technology:

    BCDMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    4.5 µs

  • Turn-on Time:

    3.5 µs

  • Width:

    7.5 mm

L9339-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for the L9339-TR should include a solid ground plane, wide power traces, and a thermal relief pattern under the IC to facilitate heat dissipation. A 4-layer PCB with a dedicated thermal layer is recommended.
  • To ensure reliable operation in high-temperature environments, ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout guidelines. Additionally, consider using a thermal interface material with a high thermal conductivity coefficient.
  • Exceeding the maximum junction temperature (Tj) of 150°C can lead to reduced lifespan, increased thermal resistance, and potentially catastrophic failure. It is essential to ensure the device operates within the recommended temperature range to maintain reliability and performance.
  • To troubleshoot overcurrent protection issues, check the input voltage, output current, and sense resistor values. Ensure the sense resistor is correctly sized and the output current is within the recommended range. Also, verify that the device is not overheating, which can trigger the overcurrent protection.
  • Not using the recommended input capacitor values can lead to instability, oscillations, or reduced performance. The input capacitors help filter the input voltage and ensure stable operation. Using incorrect values can compromise the device's performance and reliability.

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L9339-TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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