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L9997ND013TR - STMicroelectronics

Description: Dual half bridge driver

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L9997ND013TR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-20-2022
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L9997ND013TR - STMicroelectronics  - 3D model - Small Outline Packages - SO-20-2022
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L9997ND013TR Details

  • Manufacturer Part Number:

    L9997ND013TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SO-20

  • Pin Count:

    20

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.38

  • Built-in Protections:

    OVER CURRENT; OVER VOLTAGE; THERMAL

  • Interface IC Type:

    HALF BRIDGE BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Peak Current Limit-Nom:

    1.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    100 µs

  • Turn-on Time:

    150 µs

  • Width:

    7.5 mm

L9997ND013TR Frequently Asked Questions (FAQs)

  • A good PCB layout for the L9997ND013TR involves keeping the power traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the IC. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The choice of input and output capacitors for the L9997ND013TR depends on the specific application requirements. In general, X5R or X7R ceramic capacitors with a voltage rating of 10V or higher are recommended. The capacitance value should be chosen based on the output voltage and current requirements, with a general guideline of 10uF to 22uF for the input capacitor and 22uF to 47uF for the output capacitor.
  • The L9997ND013TR is rated for operation in an ambient temperature range of -40°C to 150°C. However, the device's performance and reliability may be affected at extreme temperatures, so it's recommended to operate the device within a temperature range of -20°C to 125°C for optimal performance.
  • Proper thermal management of the L9997ND013TR involves ensuring good airflow around the device, using a heat sink if necessary, and keeping the device away from other heat sources. The device's thermal pad should be connected to a solid ground plane to help dissipate heat. Additionally, the device's power dissipation should be calculated and managed to prevent overheating.
  • The L9997ND013TR is a switching regulator, and as such, it can generate electromagnetic interference (EMI). To minimize EMI, it's recommended to use a shielded inductor, keep the power traces short and away from sensitive circuits, and use a common-mode choke if necessary. Additionally, the device should be placed in a metal enclosure to reduce electromagnetic radiation.

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L9997ND013TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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