Please enter a minimum 3 letters or numbers
Technical Content
Part Image

LA9310S7S11AA - NXP

Description: Layerscape Access, 0 °C to 105 °C, standard speed, 1 VSPA, x1 PCIe, standard firmware, Rev A0, production SOT1919-1

Download LA9310S7S11AA Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
LA9310S7S11AA - NXP - PCB symbol
click to zoom
PCB Footprints
LA9310S7S11AA - NXP PCB footprint - BGA - BGA - SOT1919-1
click to zoom
3D Models
LA9310S7S11AA - NXP - 3D model - BGA - SOT1919-1
click to zoom

LA9310S7S11AA Details

  • Manufacturer Part Number:

    LA9310S7S11AA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFBGA-157

  • ECCN Code:

    3A991.A.1

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    307 MHz

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PBGA-B157

  • Length:

    8 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    157

  • On Chip Data RAM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA157,15X15,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (words):

    67584

  • Seated Height-Max:

    1.26 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR, RISC

LA9310S7S11AA Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a star-connection for the power supply to minimize noise and EMI.
  • Implement proper thermal management by providing adequate heat sinking, using a thermal interface material, and ensuring good airflow. Also, consider derating the device's operating frequency and power consumption to prevent overheating.
  • Use an ESD wrist strap or mat, handle the device by the body or pins, avoid touching the pins, and store the device in an anti-static bag or container. Also, ensure that the PCB and assembly process follow ESD-safe guidelines.
  • Yes, the LA9310S7S11AA is AEC-Q100 qualified, making it suitable for automotive applications. However, ensure that your design meets the specific requirements of the automotive industry, such as temperature range, vibration, and electromagnetic compatibility.
  • Use a logic analyzer or oscilloscope to monitor the device's signals, check the power supply and clock signals, and verify the device's configuration and programming. Consult the datasheet and application notes for specific troubleshooting guidelines.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

LA9310S7S11AA Overview

Use the download button to access the LA9310S7S11AA schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LA931, or try a keyword search, such as Microprocessors

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

Parts related to LA9310S7S11AA

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑