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LAN8710AI-EZK - Microchip

Description: Ethernet ICs 10/100 Ethernet XCVR w/HPAutoMDIX INDTEMP

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LAN8710AI-EZK - Microchip - PCB symbol
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PCB Footprints
LAN8710AI-EZK - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 32 Pin QFN
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3D Models
LAN8710AI-EZK - Microchip - 3D model - Quad Flat No-Lead - 32 Pin QFN
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LAN8710AI-EZK Details

  • Manufacturer Part Number:

    LAN8710AI-EZK

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    5 X 5 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, QFN-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    VQFN-32

  • Country Of Origin:

    Mainland China, Singapore, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Data Rate:

    100000 Mbps

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    ETHERNET TRANSCEIVER

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

LAN8710AI-EZK Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout guide in the LAN8710AI-EZK evaluation board user's guide, which includes guidelines for component placement, routing, and thermal management.
  • The LAN8710AI-EZK can be configured for different PHY modes using the strap pins or through software control using the MDIO interface. Refer to the datasheet and application notes for specific configuration details.
  • The LAN8710AI-EZK requires a specific power sequencing order to ensure proper operation. The recommended power-up sequence is VDDIO, followed by VDD, and then VDDA. Refer to the datasheet for specific power sequencing requirements.
  • Microchip provides a troubleshooting guide in the LAN8710AI-EZK datasheet and application notes, which covers common issues and debugging techniques. Additionally, engineers can use tools like oscilloscopes and logic analyzers to debug the device.
  • The LAN8710AI-EZK has a maximum junction temperature of 125°C. Engineers should ensure proper thermal management by providing adequate heat sinking, airflow, and thermal interface materials to prevent overheating.

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LAN8710AI-EZK Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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