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LB2012T4R7M - TAIYO YUDEN

Description: Power Inductors - SMD 963-LSQBA201212T4R7M RPLCMT PN 0805 4.7uH 520mOhms 190mA

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PCB Footprints
LB2012T4R7M - TAIYO YUDEN PCB footprint - Inductors Chip - Inductors Chip - 0805/2012_2024
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3D Models
LB2012T4R7M - TAIYO YUDEN  - 3D model - Inductors Chip - 0805/2012_2024
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LB2012T4R7M Details

  • Manufacturer Part Number:

    LB2012T4R7M

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    TAIYO YUDEN

  • YTEOL:

    7

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.52 Ω

  • Inductance-Nom (L):

    4.7 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1.25 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Quality Factor-Min (at L-nom):

    5

  • Rated Current-Max:

    0.19 A

  • Self Resonance Frequency:

    45 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Special Feature:

    DCR IS MEASURED AT 30% TOLERANCE

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    7.96 MHz

  • Tolerance:

    20%

LB2012T4R7M Frequently Asked Questions (FAQs)

  • The recommended land pattern for the LB2012T4R7M is a rectangular pad with a size of 1.2mm x 0.8mm, with a solder mask opening of 0.5mm x 0.3mm.
  • Yes, the LB2012T4R7M is rated for operation up to 125°C, making it suitable for high-temperature applications. However, the capacitance and ESR may vary with temperature.
  • Yes, the LB2012T4R7M is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5.
  • The LB2012T4R7M has an MSL rating of 2, which means it can withstand exposure to moisture for up to 4 days without requiring baking before reflow soldering.
  • Yes, the LB2012T4R7M is designed to withstand vibrations up to 10G, making it suitable for use in applications with high vibration levels.

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LB2012T4R7M Overview

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