LB2016T220K - TAIYO YUDEN

LB2016T220K Frequently Asked Questions (FAQs)

• What is the recommended land pattern for LB2016T220K?
  The recommended land pattern for LB2016T220K is a rectangular pad with a size of 1.6mm x 0.8mm, with a solder mask opening of 1.2mm x 0.4mm. The land pattern should be designed to accommodate the component's termination style, which is a bottom electrode with a soldering pad.
• How do I handle the component's moisture sensitivity?
  The LB2016T220K is a moisture-sensitive device (MSD) and requires special handling to prevent damage. It is recommended to store the components in a dry environment with a relative humidity of 10% or less, and to bake the components at 125°C for 24 hours before reflow soldering if they have been exposed to moisture.
• What is the maximum reflow temperature for LB2016T220K?
  The maximum reflow temperature for LB2016T220K is 260°C, with a peak temperature of 250°C. The reflow profile should be designed to avoid exceeding these temperatures to prevent damage to the component.
• Can I use LB2016T220K in a high-vibration environment?
  The LB2016T220K is designed to withstand moderate vibration, but it may not be suitable for high-vibration environments. The component's vibration resistance is specified as 10G, 10-2000Hz, and it is recommended to perform additional testing to ensure the component's reliability in high-vibration applications.
• How do I determine the component's orientation during mounting?
  The LB2016T220K has a polarity marker on the top surface, which indicates the component's orientation. The marker is a white dot or a notch, and it should be aligned with the corresponding marker on the PCB to ensure correct orientation during mounting.