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LBEE5XV1YM-574 - Murata Electronics

Description: Bluetooth, WiFi 802.11a/b/g/-c, Bluetooth v5.2 Transceiver Module 2.4GHz ~ 5.825GHz Antenna Not Included, U.FL Surface Mount

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PCB Footprints
LBEE5XV1YM-574 - Murata Electronics PCB footprint - Other - Other - LBEE5XV1YM-574-7
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3D Models
LBEE5XV1YM-574 - Murata Electronics  - 3D model - Other - LBEE5XV1YM-574-7
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LBEE5XV1YM-574 Details

  • Manufacturer Part Number:

    LBEE5XV1YM-574

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    28 Weeks

  • Manufacturer:

    Murata Manufacturing Co Ltd

  • YTEOL:

    0

  • Moisture Sensitivity Level:

    3

  • Peak Reflow Temperature (Cel):

    250

  • Time@Peak Reflow Temperature-Max (s):

    10

  • uPs/uCs/Peripheral ICs Type:

    RFSOC

LBEE5XV1YM-574 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the LBEE5XV1YM-574 is -40°C to +85°C.
  • The transmission power of the LBEE5XV1YM-574 can be configured through the module's AT commands or by using the module's API. Refer to the module's documentation for specific instructions.
  • The maximum data transfer rate of the LBEE5XV1YM-574 is 921.6 kbps.
  • Yes, the LBEE5XV1YM-574 is designed to operate in humid environments, but it's recommended to follow the manufacturer's guidelines for humidity and temperature ranges to ensure reliable operation.
  • Firmware updates for the LBEE5XV1YM-574 can be performed using the module's bootloader and a dedicated software tool provided by Murata. Refer to the module's documentation for specific instructions.

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LBEE5XV1YM-574 Overview

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About Murata Electronics

Murata Manufacturing Co., Ltd. is a Japanese multinational company that specializes in the design, manufacturing, and sale of electronic components and solutions. Murata offers a wide range of electronic components and modules that are used in various industries and applications. Some of their key product categories include: capacitors, inductors, resistors, sensors, rf components and modules, and power devices.

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